DPM Argelite 70+
Palladium Base Alloys for Ceramics
| Color | WHITE |
| Type | 4 |
| ADA Class | NOBLE (N) |
|
Application
  
|
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| Processing | |
|---|---|
| Investment | Phosphate Bonded (Carbon Free) |
| Crucible | Ceramic |
| Degassing Temp C | 650-1040 |
| Oxidation Procedure | Hold 5 Min, Remove Oxide, No Vacuum |
| Solder & Laser Wires | |
|---|---|
| PreSolder | W, WSF |
| PostSolder | LO, 500 |
| Laser Wire | LWL75 |
| Physical Properties | |
|---|---|
| VHN After Firing | 260 |
| VHN Soft | |
| VHN Hard | |
| Proof Stress Soft MPa | 621 |
| Proof Stress Hard MPa | |
| Tensile Strength Soft MPa | 1035 |
| Tensile Strength Hard MPa | |
| Elongation Soft | 15 |
| Elongation Hard | |
| Elastic Modulus GPa | 120 |
| Composition | |
|---|---|
| Silver (Ag) | 9.5 |
| Gold (Au) | 3.0 |
| Indium (In) | 2.0 |
| Palladium (Pd) | 70.0 |
| Tin (Sn) | 9.8 |
| Zinc (Zn) | 5.0 |
| Ruthenium (Ru) | 0.1 |
| Gallium (Ga) | 0.5 |
| Rhenium (Re) | 0.1 |
| Thermal Properties | |
|---|---|
| Melting Range C | 1180-1290 |
| Casting Temp C | 1345 |
| Density g/cc | 10.7 |
| Expansion at 500C | 14.1 |
| Expansion at 600C | 14.4 |
| Burnout Temp C | 815 |