DPM Argelite 58P
Palladium Base Alloys for Ceramics
| Color | WHITE |
| Type | 4 |
| ADA Class | NOBLE (N) |
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Application
  
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| Processing | |
|---|---|
| Investment | Phosphate Bonded |
| Crucible | Graphite / Ceramic |
| Degassing Temp C | 650-950 |
| Oxidation Procedure | Hold 10 Min, Removal Of Oxide Optional, No Vacuum |
| Solder & Laser Wires | |
|---|---|
| PreSolder | W, P |
| PostSolder | LO, 500 |
| Laser Wire | LWL58 |
| Physical Properties | |
|---|---|
| VHN After Firing | 250 |
| VHN Soft | |
| VHN Hard | 260 |
| Proof Stress Soft MPa | 500 |
| Proof Stress Hard MPa | 550 |
| Tensile Strength Soft MPa | 650 |
| Tensile Strength Hard MPa | 703 |
| Elongation Soft | 20 |
| Elongation Hard | 14 |
| Elastic Modulus GPa | 129 |
| Composition | |
|---|---|
| Silver (Ag) | 30.0 |
| Indium (In) | 4.0 |
| Palladium (Pd) | 57.9 |
| Tin (Sn) | 6.0 |
| Zinc (Zn) | 2.0 |
| Ruthenium (Ru) | 0.05 |
| Rhenium (Re) | 0.05 |
| Thermal Properties | |
|---|---|
| Melting Range C | 1230-1280 |
| Casting Temp C | 1430 |
| Density g/cc | 11.3 |
| Expansion at 500C | 14.7 |
| Expansion at 600C | 14.9 |
| Burnout Temp C | 820 |