DPM Argebond 80
Palladium Base Alloys for Ceramics
Color | WHITE |
Type | 4 |
ADA Class | NOBLE (N) |
Application
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Processing | |
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Investment | Phosphate Bonded (Carbon Free) |
Crucible | Ceramic |
Degassing Temp C | |
Oxidation Procedure | Hold 5 Min, Remove Oxide, No Vacuum |
Solder & Laser Wires | |
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PreSolder | W, WSF |
PostSolder | LO, 500 |
Laser Wire | LWT80 |
Physical Properties | |
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VHN After Firing | 230 |
VHN Soft | |
VHN Hard | 245 |
Proof Stress Soft MPa | 585 |
Proof Stress Hard MPa | 631 |
Tensile Strength Soft MPa | 780 |
Tensile Strength Hard MPa | 854 |
Elongation Soft | 35 |
Elongation Hard | 28 |
Elastic Modulus GPa | 130 |
Composition | |
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Silver (Ag) | 5.0 |
Indium (In) | 6.5 |
Palladium (Pd) | 80.0 |
Tin (Sn) | 0.7 |
Zinc (Zn) | 1.0 |
Ruthenium (Ru) | 0.5 |
Gallium (Ga) | 6.3 |
Thermal Properties | |
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Melting Range C | 1100-1290 |
Casting Temp C | 1370 |
Density g/cc | 11.2 |
Expansion at 500C | 14.2 |
Expansion at 600C | 14.4 |
Burnout Temp C | 815 |